Eindhoven-based Invisix has raised an oversubscribed €20 million seed round in May 2026, adding fresh funding to a growing area of semiconductor tooling focused on advanced measurement challenges. The round included Hitachi Ventures, Transition Ventures, imec.xpand, Doosan Investment Co., and a tier-1 semiconductor manufacturer.
Invisix develops soft x-ray metrology tools for advanced chip manufacturing. Its technology is designed to non-destructively measure complex internal 3D structures in semiconductor devices, an area of increasing importance as chip architectures become smaller and more complex.
The company said it will use the funding to grow its team, accelerate development of its first shippable system, and support customer demonstrations at a new clean room in Eindhoven.
The raise highlights continued investor interest in semiconductor infrastructure companies building tools for next-generation manufacturing, particularly in metrology, where demand is rising alongside the complexity of advanced logic and memory devices.
Invisix develops soft x-ray metrology tools for advanced chip manufacturing. Its technology is designed to non-destructively measure complex internal 3D structures in semiconductor devices, an area of increasing importance as chip architectures become smaller and more complex.
The company said it will use the funding to grow its team, accelerate development of its first shippable system, and support customer demonstrations at a new clean room in Eindhoven.
The raise highlights continued investor interest in semiconductor infrastructure companies building tools for next-generation manufacturing, particularly in metrology, where demand is rising alongside the complexity of advanced logic and memory devices.